The DoD desires the capability to detect and counter emerging threats in the electromagnetic spectrum (EMS), providing warfighters with an enhanced understanding of their battlefield environment. The RFSD aims to collect and analyze RF signals to compare against a baseline environment, and automatically alert warfighters to anomalous signals.
The United States Navy and Air Force, in support of the Office of the Secretary of Defense (OSD), is developing integrated circuit (IC) hardware and workflow prototypes that promote the use of assurance principles, feature protections, and correlation.
The Department of Defense desires the development of capability sets that can replicate with high fidelity a wide band and dynamic range of electromagnetic spectrum waveforms and signatures in both frequency and power.
The DoD desires innovative prototype solutions for predictive models that utilize novel approaches to analyze, forecast and identify multi-domain capability gaps related to Electronic Warfare (EW), Information Warfare (IW), Electromagnetic Spectrum Operations (EMSO), Electromagnetic Warfare (EMW), and Cyber Warfare.
The DoD is seeking innovative solutions for prototype radiation-hardened by design (RHBD) libraries in both the 45RF and 22FDX technology nodes available from GlobalFoundries.
The DoD desires innovative prototype solutions for an Autonomous Fiber Optic Sensor Network (A-FOSN), a passive opto-acoustic fiber optics sensor system that measures the micro strain of sound waves on continuous wave laser light utilized in a buried fiber optic cable array for detecting intruders into U.S. Navy ports.
As part of this effort, a part-centric supply chain tool will be developed that will determine the supply chain risk of specified microelectronic components so that DoD programs can make more informed decisions on selection of components for system design and overall acquisition process.
The Navy desires to develop a state-of-the-art (SOTA) heterogeneous integrated packaging (SHIP) prototype to demonstrate enhanced fabrication and packaging access for the Department of Defense (DoD) programs.
This project will seek proposals for the development of prototype processes and materials for the manufacture of very high density substrate, interposer and redistribution layer electronic device packaging interconnect products using polymer based substrate materials.
Prototype FPGA Integrated Assurance Analysis, Logical & Physical Non-Destructive Verification Tool Development
This project will support the development, demonstration, and exploitation of technologies, algorithms, and methods to expand the ability and improve microelectronics testing and verification methodologies in support of verifying the trust and assurance of Field Programmable Gate Arrays (FPGAs) with Analysis Tools; and Built-In-Self-Tests (BIST).