The purpose of the Joint Acceleration of Hypersonic Vehicle Aerostructure Alternatives (JAHVAA) program is to extend material and processing development and testing of non-Carbon/Carbon (C/C) Thermal Protection System (TPS) materials to establish trusted design allowable data, driving down material transition risks and enabling greater flexibility in hypersonic systems design.
Naval Surface Warfare Center, Crane is establishing a modular and flexible, system-level HWIL for avionics analysis. Prototype solutions are being sought for a system-level HWIL infrastructure to support the verification of system and mission performance, and to provide a platform to test and integrate advanced capabilities under various environmental and threat stimuli in real-time.
Naval Surface Warfare Center (NSWC) Crane seeks to expand its partnership with traditional and nontraditional industry sources to identify solutions for weapons system Position, Navigation, and Timing (PNT) accuracy opportunities and execute rapid demonstration for potential inclusion to a fielded program portfolio. The intent is to identify, accelerate maturity, and demonstrate technologies in simulated lab environments and onboard development flight tests. Upon development and successful demonstration, NSWC Crane will consider the technologies for program portfolio inclusion.
The Department of the Navy (DoN) and the United States Special Operations Command is seeking to develop direction finding antenna system by modifying the latest antenna technology commercially available providing an improvement in the ability to collect, process, locate and exploit Signals of Interest (SOI) enhancing the mission performance of providing timely, relevant, and responsive threat avoidance information.
Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE)
The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Trusted & Assured Microelectronics program is seeking advanced packaging prototype devices that will 1) transition into a targeted military system and 2) be made available to the Defense Industrial Base (DIB) for broad use in military systems.
The Department of the Navy (DoN) is seeking prototypes in support of the GAMMA-H project to comprehensively advance the domestic manufacturing readiness in support of hypersonic cruise missile (HCM) development and transition to production.
The SHIP Program – also referred to as State of the Art Heterogeneous Integrated Packaging – is developing four prototype Multichip Packages (MCPs). Building off of the successful SHIP program, a pilot will be established to facilitate the transition of these MCPs to military systems by partnering with the Defense Industrial Base. The pilot program will be called Stimulating Transition for Advanced Microelectronics Packaging (STAMP).
The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E))’s Microelectronics program has a need for domestic prototyping capability to accelerate technology demonstration. Due to the very high complexity of integrated microelectronic systems today, there is an urgent need to establish a network of domestic prototyping facilities to demonstrate, at-scale, the system-level benefits...
The Department of the Navy (DoN) is seeking an experimentation project due to the result of Hypersonic flight environments in extreme heat loads which necessitate the use of high-temperature capable Carbon/Carbon (C/C) composites for thermal protection systems (TPS) and hot structures. Unfortunately, C/C manufacturing capability in the United States has atrophied...
The Department of Defense (DoD) is seeking a prototype that establishes the capability to manage electronic parts across the enterprise. The purpose of this prototype is to grant visibility into the supply chain, enable better supply chain risk management, allow aggregation of demand, improve purchasing power, enable collaborative solutions to obsolescence and other parts...
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The Office of the Undersecretary of Defense, Research & Engineering (OUSD(R&E)) Trusted & Assured Microelectronics (T&AM) program is seeking to mature co-packaged optics (CPO), laser sources, and associated advanced packaging techniques for prototype demonstration and technology transition into the DoD advanced packaging ecosystem and the Defense Industrial Base …
The Department of the Navy (DoN) is seeking an experimentation project resulting in a proof of concept and prototype demonstration of modular Experimental Glide Body (EGB) testing hypersonic technologies/experimental payloads in operational trajectories using already available boosters.
The Department of the Navy (DoN) is seeking a manufacturing proof-of-concept prototype for high-rate production of composite parts and assemblies with complex geometries for hypersonic vehicle applications that produces trusted quality parts with significant reduction in per unit time.
The Department of the Navy (DoN) is seeking prototypes that fabricate/demonstrate a total of three articles (two unclassified and one classified) using Chemical Vapor Infiltration (CVI) Carbon/Silicon Carbide (C/SiC) densification of carbon fiber preforms.
The Department of the Navy (DoN) is seeking prototypes that demonstrate one or more Additive Manufacturing (AM) techniques to protect against one or more identified Technology Protection (TP) threats.
The Department of Defense (DoD) is seeking prototype support in the area of 5G Operate Through initiative seeking to identify, demonstrate, and assess capabilities that will provide solutions to operate through a wide range of 5G communication infrastructures.
The Department of the Navy (DoN) is seeking prototype support that seeks to identify, demonstrate, and assess capabilities that will provide solutions to operate through a wide range of 5G communication infrastructures that are under the cognizance of the Department of Defense (DoD).